Recognized as a Finalist in the Innovative Product of the Year Category for ABR's ultra-efficient edge AI Time-Series Processor (TSP) chip.

Utilizing proprietary nano-coating technology, Forge Nano is able to fundamentally improve nearly any material on earth at the atomic level.

Semiconductor industry veteran with over 40 years of analog integrated circuit experience

Project Tango: Creating the LED Fixture of the Future

The Gocator® 5000 series adds powerful line confocal imaging (LCI) technology to the Gocator® family of trusted laser and structured light 3D smart sensors.

Enabling Personalized and Mass AR displays

Led by Cycle Capital, round includes strategic investor TDK Ventures, and Vitro

TEAL products offer high performance power conditioning and distribution for demanding applications.

The Time is Now for MRAM-based Memory IP Cores

Demco Automation develops automated manufacturing systems using new robotic technologies to a growing list of industries, including life science, pharmaceuticals, biotech, medical device, defense, aerospace, electronics, commercial/industrial products, semiconductors, and consumer products.

Pennsylvania-based injection molder sweeps Plastics Technology's inaugural Hot Shots part competition

Showcasing Wi-Fi HaLow Sensor Networking at Sensors Expo 2021: September 22-23, 2021, in San Jose, California

AiOnIc combines a 12 nm fabrication process with ArchiTek Intelligence®, a proprietary image processing architecture, to deliver a de facto standard SoC for secure edge-to-edge computing

Enables better keyword speech recognition performance for devices like smartphones, smart speakers, wearables, and earpieces

Founded in 2017 in La Palma, California, SeeDevice is a leader in the development of smart vision sensors using quantum tunneling technology to see further, sense faster, and deliver higher quality images in more lighting conditions than current CMOS sensors.

Multiple APAC operators to adopt Amlogic's solutions through Hailstorm

Amlogic's 4K STB platform solutions running Android P are fully compliant with Widevine CAS

Company Demonstrating 1GB DDR 4K (1G4K) Android TV Ready Set-Top Box Solution Running Android 9 Pie at IBC2018 in Amsterdam

New 1GB DDR Memory advancement promotes cost savings

Micro 0.50 mm pitch edge card socket for space and cost savings

Proven SEARAY™ Connectors Provide Reliable SI Performance in Rugged Environments

Providing End-to-End Solutions for the Broadcast Video Ecosystem

Extreme Power/Signal System with up to 60 A/Blade and a Low 10 mm Profile.

New crypto mining technology acquired

NIAP-Certified MicroCloud X4™ Full Drive Encryption Solutions are Available for National Security Systems Procurement

Unique Modular Design Boosts Performance While Reducing Size in Internet of Things and Enterprise Applications

UPMEM secures 3 million € round with C4 Ventures, Partech Ventures, Supernova Invest, Western Digital Capital, CA, tech entrepreneurs.

The Electronic Components Industry Association (ECIA) welcomes its newest member, Manufacturer Representative in Israel, Artec Lantec

Gianluca Martino, 43 years-old, Turin, having started his challenge as a Senior Advisor of Fluo Technology, explains the main features and purposes of this new project.