SySDSoft LTE UE Protocol Stack Achieves 375 Mbps Throughput (CAT5)

Online, October 18, 2010 (Newswire.com) - SySDSoft Inc., a global provider of 4G wireless protocol stacks, announced today the completion of its LTE UE protocol stack performance tests. The highly-performing stack achieved the highest throughput available in the market to-date with simultaneous 300Mbps DL and 75 Mbps UL (CAT5) data rates.

"SySDSoft has become an icon in the LTE UE stack market", said Khaled Ismail, CEO of SySDSoft, commenting on SySDSoft's stack performance. "With our outstanding implementation, and the world class support service offered to our customers, we are justifying our position as the leading provider of software protocol stacks for the LTE chip makers." he added.

Throughout the performance tests, the UE stack has been exposed to a stream of data packets with different sizes ranging from 1518 bytes down to 64 bytes. The stack has shown a solid performance even at small packet sizes, together with efficient memory usage, and processor utilisation. At 1518 bytes packet size and 300 Mbps DL and 75 Mbps UL data rates, the stack requires around 100 MIPS only. The solution comprises Layer 2, Layer 3 and NAS following the 3GPP September Release. The Stack is TDD/FDD-compliant and multi-mode ready.

About SySDSoft

SySDSoft Inc. designs high performance, embedded software solutions for the wireless broadband market. The company's portfolio spans a variety of wireless standards including: WiFi 802.11, WiMAX 802.16-2004, WiMAX 802.16-2005, CDMA-DO, ZigBee Wireless USB, and 3GPP LTE. SySDSoft's solutions, offered to silicon and portable device manufacturers, are designed to meet the substantial projected growth in wireless device markets geared towards 4G. For more information, visit www.sysdsoft.com/lte.htm