Bare Board Group to Sponsor Job Fair for High Tech PCB Manufacturer's Representatives.

Online, May 14, 2012 (Newswire.com) - Bare Board Group, an international supplier of printed circuit boards, announced that they will sponsor a job fair focused on high tech PCB manufacturing representatives. Early this year, the PCB supplier expanded their coverage and support with the addition of BBG North, a sales and service office in Toronto, Canada. In an effort to continue the path of growth and increased technology offerings, BBG has added Graphic PLC as their high technology mil / aero partner for complex multilayer and rigid flex products.

BBG's expanded catalog now includes high layer count(up to 42), rigid and flex technology, AMC - advanced mezzanine cards, sequential micro vias & sequential stacked vias, buried resistance/capacitance, thermal management, embedded technologies, HDI rigid/ rigid flex product types, CTE restricted structures using C-I-C / carbon core, and 3D structures.

Due to the expanded Canadian presence and increased technology footprint, the Bare Board Group will be pursuing seasoned manufacturer's representatives, both US and Canadian, from the PCB industry to strengthen its team. To promptly connect with sales individuals seeking new opportunities as well as those recently displaced by industry mergers and acquisitions, the job fair will be held shortly in Chicago, IL on June 13, 2012 at the Holiday Inn Express Chicago O'Hare. In addition to the seminar, Sir Rex Rozario of Graphic PLC, and BBG President, Greg Papandrew, as well as BBG's US and Canadian sales directors will be on hand to expand on partner capabilities and answer all questions regarding representing the Bare Board Group.

Positions for experienced PCB inside sales and engineering staff are also available.

For more information or to book your space at the event, please contact Tobey Marsicovetere at tobey@bareboard.com or visit www.bareboard.com.