AI Technology, Inc. (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF), Combines High Glass Transition Temperature and Stress Absorption with Proven Thermal Performance in Die-Attach Power Dissipation
May 6, 2014 (Newswire) - AI Technology, Inc. (AIT) has solved one of the technically more challenging problems in wafer level semiconductor packaging to achieve conductive die-attach film adhesive (DAF) of 20 micron thickness. While die-attach film adhesive (DAF) at the wafer level is becoming more prevalent in die-attach for memory modules in precision bonding and thin packages, thermally conductive and electrically conductive die-attach film is more limiting because of the challenging handling and performance issues for the thinner conductive DAF.
AIT's conductive DAF is built on the same self-supporting die-attach film (DAF) adhesive technology that the company pioneered in the 1990's. AIT is now able to produce ESP8660-HK in 20 micron thickness for power devices from microprocessors to concentrated solar die-attach modules. This new thickness marks an improvement over AIT's 50 microns thick ESP8660-HF which was first produced in 2005.
ESP866-HF can be produced in wafer-shape die-cut format and pre-laminated on dicing tape (DDAF) format up to widths of 450mm and lengths of 100 meters in AIT's clean room manufacturing environment housed in the company's 16 acres facilities in Princeton Junction, NJ.
Not only is ESP8660-HK available in 20 micron thickness, it is also developed for high glass transition requirements to facilitate faster wire-bonding at temperatures as high as 250°C. ESP8660-HK is also molecularly engineered to reduce stress and ultimately improve the reliability of multi-chip module (MCM) and system in package (SIP) devices.
In addition to achieving one of the lowest thermal resistances with thermal conductivity of over 8 W-m/°K, ESP8660-HK maintains its bond strength after 85%RH/85°C and demonstrates reliability test results after thermal cycling and shock that are not common even for traditional paste die-attach adhesives.
About AI Technology, Inc. (AIT):
Since pioneering the use of flexible epoxy technology for microelectronic packaging in 1985, AI Technology, Inc. (AIT) has been one of the leading forces in development and patented applications of advanced materials and adhesive solutions for electronic interconnection and packaging. AI Technology, Inc. (AIT) offers some of the most reliable adhesives and underfills for die bonding for the largest dies, stack-chip packaging with dicing die-attach film (DDAF), flip-chip bonding and underfilling and high temperature die bonding for single and multiple-chip modules for applications beyond 230°C. The company continues to provide the best adhesive solution for component and substrate bonding for both military and commercial applications.
AIT's thermal interface material solutions, including our patented phase-change thermal pads, thermal greases and gels and thermal adhesives have set many bench marks of performance and reliability for power semiconductors, modules, computers and communication electronics.
For an application analysis: http://www.aitechnology.com/analysis/
AI Technology, Inc. (AIT) Web Address: http://www.aitechnology.com/
70 Washington Rd.
Princeton Jct. NJ 08550
P: (609) 799 - 9388
F: (609) 799 - 9308
Media Contact: Amy Grossman, (609) 799-9388, email@example.com